Many rapid prototyping methods are used for rapid prototyping of hand board. Let's take a look at it together:

熔融沉積工藝熔融沉積（FDM）工藝是將絲狀的熱塑性材料按特定溫度融化，使材料始終保持液體狀態(tài)，通過擠出頭勻速擠出。在成型數(shù)據(jù)的控制下，有選擇的沉積在工作平臺上，沉積后立即冷卻并固化成型。

Melt deposition process melt deposition (FDM) process is to melt the filamentous thermoplastic material at a specific temperature to keep the material in a liquid state all the time and extrude it at a uniform speed through the extrusion head. Under the control of molding data, it is selectively deposited on the working platform, cooled and solidified immediately after deposition.

立體光固化工藝立體光固化（SLA）工藝利用了光敏樹脂的材料特性，即在一定波長和強度的紫外光束照射下可以實現(xiàn)從液態(tài)到固態(tài)的相變。紫外光束的運動軌跡通過成型數(shù)據(jù)來控制，在光敏樹脂表面進行選擇性的掃描，實現(xiàn)逐點固化成型。

Stereolithography process stereolithography (SLA) process makes use of the material characteristics of photosensitive resin, that is, the phase transition from liquid to solid can be realized under the irradiation of ultraviolet beam with certain wavelength and intensity. The trajectory of UV beam is controlled by molding data, and selective scanning is carried out on the surface of photosensitive resin to realize point by point curing molding.

三維印刷工藝三維印刷（3DP）工藝的原理為粉末狀材料在黏合劑的作用下的黏結(jié)成型。在工作平臺上先鋪一層粉末狀材料，再使用噴嘴將黏合劑分布于需要成型的粉末區(qū)域，實現(xiàn)了粉末的黏合成型。

Three dimensional printing process the principle of three dimensional printing (3DP) process is the bonding molding of powder materials under the action of adhesive. Firstly, a layer of powder material is paved on the working platform, and then the nozzle is used to distribute the adhesive in the powder area to be formed, so as to realize the adhesive forming of the powder.

選擇性激光燒結(jié)工藝選擇性激光燒結(jié)（SLS）工藝的原理為粉末狀材料在激光燒結(jié)下的熔化結(jié)合。在工作平臺上先鋪一層接近熔點的粉末狀材料，再使用激光在該層粉末上選擇性的掃描，被掃描區(qū)域的粉末溫度升高， 熔化后燒結(jié)成型。

Selective laser sintering process the principle of selective laser sintering (SLS) process is the melting and bonding of powder materials under laser sintering. A layer of powdery material close to the melting point is paved on the working platform, and then the laser is used to selectively scan the layer of powder. The powder temperature in the scanned area increases, and then sintered.

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